We specialize in producing single-crystal lithium niobate & lithium tantalate thin films, and provide professional processing services. 

Ion Implantation

Energy

35-400KeV

Size 

2’’, 3’’, 4’’, 6’’

Beam current 

<1mA

Type of ions

H+,H2+,H3+, He+, Ar+

TECHNICAL PARAMETERS:

Wafer Thinning

Materials

LN, LT, Quartz, Silicon, Glass etc.

Size 

3/4/6 inch

Thickness

20~1000μm

TTV

<1μm

Ra

<0.15μm

TECHNICAL PARAMETERS:

PECVD

Wafer size

3’’~6’’

Thickness 

0.5μm-5μm

TTV

<±5%

TECHNICAL PARAMETERS:

CMP

Wafer size

3’’~6’’

Materials 

LN, LT, Quartz, Si, SiO2, etc.

Ra

<0.5nm

TTV

<±3%

TECHNICAL PARAMETERS:

Wafer Dicing Service

Wafer size

Material

all kinds of wafers and electronic components

all size below 6inch’

TECHNICAL PARAMETERS: