We specialize in producing single-crystal lithium niobate & lithium tantalate thin films, and provide professional processing services.
Ion Implantation
Energy
35-400KeV
Size
2’’, 3’’, 4’’, 6’’
Beam current
<1mA
Type of ions
H+，H2+，H3+, He+, Ar+
TECHNICAL PARAMETERS:
Wafer Thinning
Materials
LN, LT, Silicon etc.
Size
3/4/6 inch
Thickness
20~1000μm
TTV
＜1μm
Sun
＜0.15μm
TECHNICAL PARAMETERS:
PECVD
Wafer size
3’’~6’’
Thickness
0.5μm-5μm
TTV
＜±5%
TECHNICAL PARAMETERS:
CMP
Wafer size
3’’~6’’
Materials
LN, LT, Si, SiO 2 , etc.
Sun
＜0.5nm
TTV
＜±3%
TECHNICAL PARAMETERS:
Wafer Dicing Service
Wafer size
Material
all kinds of wafers and electronic components
all sizes below 6 inch
TECHNICAL PARAMETERS: